PCB Assembly >
Lectronix expertise is in the assembly of high mix, high density printed circuit board assemblies. We support both high and low-mix assembly volumes that range from just a few prototype units to modest quantities for pre-production, to thousands in volume production.
Lectronix Printed Circuit Board Assembly (PCBA) Capabilities
Driven by the skills of our in-house engineering experts, we provide:
- Optimized test development and support that considers all aspects of test, including failure analysis
- Competitive test cost, quality and availability
- Services including Optical and X-ray inspection (AOI and AXI), and functional test (FT) development
Lectronix Electronic Manufacturing Capabilities
As a leading provider of Printed Circuit Board Assembly (PCBA), Lectronix offers customers a full range of assembly services, including:
- High density products
- Low-volume prototyping
- Low-volume / high-mix
- High volume/low mix
- Build to order
- Configure to order
Lectronix Technology Component Placement Capabilities
We combine advanced processes with highly skilled resources. Our innovative techniques extend to sophisticated packaging and assembly technology to including:
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Discrete components down to 0402
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12mil high pin count leaded packages
Down to .5mm micro-BGA
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QFN package devices
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No clean solder process
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Leaded and Lead-free (ROHS)
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Conformal Coat
